Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12486062Application Date: 2009-06-17
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Publication No.: US08410557B2Publication Date: 2013-04-02
- Inventor: Haruki Yoneda , Kazuhiro Sasada
- Applicant: Haruki Yoneda , Kazuhiro Sasada
- Applicant Address: US AZ Phoenix
- Assignee: Semiconductor Components Industries, LLC
- Current Assignee: Semiconductor Components Industries, LLC
- Current Assignee Address: US AZ Phoenix
- Agency: Morrison & Foerster LLP
- Priority: JP2008-168185 20080627
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A P type drift layer is formed in an N type epitaxial layer from under a drain layer to under an N type body layer under a source layer through under an element isolation insulation film. This P type drift layer is shallower immediately under the drain layer than under the element isolation insulation film, and gradually shallows from under the element isolation insulation film to the N type body layer to be in contact with the bottom of the N type body layer. Since the P type drift layer is thus diffused in a wide region, a wide current path is formed from the N type body layer to the drain layer, and the current drive ability is enhanced and the drain breakdown voltage is also increased.
Public/Granted literature
- US20090321852A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2009-12-31
Information query
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