Invention Grant
- Patent Title: Semiconductor device, method of manufacturing the same, and wireless transmission system utilizing the same
- Patent Title (中): 半导体装置及其制造方法以及利用该装置的无线传输系统
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Application No.: US12903336Application Date: 2010-10-13
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Publication No.: US08410564B2Publication Date: 2013-04-02
- Inventor: Hirofumi Kawamura
- Applicant: Hirofumi Kawamura
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: SNR Denton US LLP
- Priority: JP2009-243108 20091022
- Main IPC: H01L27/14
- IPC: H01L27/14
Abstract:
A device, and method for manufacturing the same, including a semiconductor package which allows transmission therethrough of a radio signal, a chip which generates the radio signal and a coupler adjacent the chip and effective to radiate the radio signal to outside of the semiconductor package.
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