Invention Grant
US08410589B2 Lead frame, resin package, semiconductor device and resin package manufacturing method
有权
引线框架，树脂封装，半导体器件和树脂封装制造方法
- Patent Title: Lead frame, resin package, semiconductor device and resin package manufacturing method
- Patent Title (中): 引线框架，树脂封装，半导体器件和树脂封装制造方法
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Application No.: US12545176Application Date: 2009-08-21
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Publication No.: US08410589B2Publication Date: 2013-04-02
- Inventor: Yasuo Matsumi , Mitsuo Maeda
- Applicant: Yasuo Matsumi , Mitsuo Maeda
- Applicant Address: JP Tokyo
- Assignee: Sumitomo Chemical Company, Limited
- Current Assignee: Sumitomo Chemical Company, Limited
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPP2008-214349 20080822
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A pressure loss section H1 (H2) extends from a position corresponding to a corner of a resin package, and S1 is the minimum value of the opening area of the pressure loss section H1 (H2) perpendicular to the direction of resin flow (X axis) in the pressure loss section H1 (H2) during resin molding, while S2 is the average value of the opening areas of excess resin reservoirs H3 to H5 perpendicular to the direction of resin flow (Y axis) within excess resin reservoir H3 to H5 during molding. In this lead frame, S1
Public/Granted literature
- US20100044844A1 LEAD FRAME, RESIN PACKAGE, SEMICONDUCTOR DEVICE AND RESIN PACKAGE MANUFACTURING METHOD Public/Granted day:2010-02-25
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