A semiconductor module (1) which has semiconductor chips (2) each with one power supply electrode (6, 7) on its back, respectively for applying a supply potential (4, 5) and each with a power output electrode (8, 9) on its top side, respectively for transferring an output current to power outputs (10, 11, 12) of the semiconductor module (1). Furthermore, the semiconductor chips (2) have control electrodes (14, 15) for switching the semiconductor component. The semiconductor module has on its underside leads with supply leads on which the semiconductor chips (2, 3) are arranged with their power supply electrodes (6, 7). In addition, output leads (22, 23, 24) are effectively connected to the power output electrodes (8, 9). Finally, signal leads (25, 26, 27), which are effectively connected to the control electrodes (14, 15) or the power output electrodes (8, 9) are arranged on the underside of the semiconductor modules.