Invention Grant
- Patent Title: Semiconductor device and method for producing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11869363Application Date: 2007-10-09
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Publication No.: US08410592B2Publication Date: 2013-04-02
- Inventor: Ralf Otremba , Xaver Schloegel
- Applicant: Ralf Otremba , Xaver Schloegel
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies, AG
- Current Assignee: Infineon Technologies, AG
- Current Assignee Address: DE Neubiberg
- Agency: Edell, Shapiro & Finnan, LLC
- Priority: DE102006047761 20061006
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/48 ; H01L23/52 ; H01L21/00 ; H01L21/44

Abstract:
A semiconductor device includes a vertical transistor and an external contact plane. The transistor includes: a first side with a first load electrode and a control electrode, and an opposite second side with a second load electrode. The first side of the transistor faces the external contact plane. A dielectric layer extends from at least one edge side of the transistor as far as the second load terminal. An electrically conductive deposited layer is arranged on the dielectric layer and electrically connects the second load electrode to the second load terminal.
Public/Granted literature
- US20080087913A1 Semiconductor Device and Method for Producing the Same Public/Granted day:2008-04-17
Information query
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