Invention Grant
US08410600B2 Semiconductor device with protecting film and method of fabricating the semiconductor device with protecting film
有权
具有保护膜的半导体器件和制造具有保护膜的半导体器件的方法
- Patent Title: Semiconductor device with protecting film and method of fabricating the semiconductor device with protecting film
- Patent Title (中): 具有保护膜的半导体器件和制造具有保护膜的半导体器件的方法
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Application No.: US12876614Application Date: 2010-09-07
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Publication No.: US08410600B2Publication Date: 2013-04-02
- Inventor: Alexander B. Lostetter , Jared Hornberger , Takukazu Otsuka
- Applicant: Alexander B. Lostetter , Jared Hornberger , Takukazu Otsuka
- Applicant Address: US AR Fayetteville JP
- Assignee: Arkansas Power Electronics International, Inc.,Rohm Co., Ltd.
- Current Assignee: Arkansas Power Electronics International, Inc.,Rohm Co., Ltd.
- Current Assignee Address: US AR Fayetteville JP
- Agency: Cantor Colburn LLP
- Main IPC: H01L29/41
- IPC: H01L29/41

Abstract:
Provided are a semiconductor device and a method of fabricating the semiconductor device, the semiconductor device including: a source trace, a drain trace, and a gate trace placed on a substrate; a transistor which is placed on the drain trace and includes a source pad and a gate pad; insulating films placed between the drain and source traces and between the drain and gate traces on the substrate so as to cover sidewall surfaces of the transistor; a source spray electrode which is placed on the insulating film between the source and drain traces and connects the source pad of the transistor and the source trace; and a gate spray electrode placed on the insulating film between the gate and drain traces and connects the gate pad of the transistor and the gate trace.
Public/Granted literature
- US20110079792A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE Public/Granted day:2011-04-07
Information query
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