Invention Grant
- Patent Title: Interconnect structure device
- Patent Title (中): 互连结构设备
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Application No.: US13233312Application Date: 2011-09-15
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Publication No.: US08410608B2Publication Date: 2013-04-02
- Inventor: Makoto Wada , Yuichi Yamazaki
- Applicant: Makoto Wada , Yuichi Yamazaki
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Turocy & Watson, LLP
- Priority: JP2010-226017 20101005
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
According to one embodiment, a device includes an insulating layer with a first trench, a first interconnect layer in the first trench, the first interconnect layer including copper and includes a concave portion, and a first graphene sheet on an inner surface of the concave portion.
Public/Granted literature
- US20120080796A1 DEVICE Public/Granted day:2012-04-05
Information query
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