Invention Grant
- Patent Title: Interconnect regions
- Patent Title (中): 互连区域
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Application No.: US13607407Application Date: 2012-09-07
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Publication No.: US08410612B2Publication Date: 2013-04-02
- Inventor: Kyle K. Kirby , Philip J. Ireland
- Applicant: Kyle K. Kirby , Philip J. Ireland
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L23/48
- IPC: H01L23/48

Abstract:
Some embodiments include interconnect regions. The regions may contain, along a cross section, a closed-shape interior region having an electrically conductive material therein, a first dielectric material configured as a liner extending entirely around a lateral periphery of the interior region, and at least two dielectric projections joining to the dielectric material liner and being laterally outward of the interior region. The dielectric projections may have an outer dielectric ring surrounding an inner dielectric region. The outer ring may consist of the first dielectric material and the inner dielectric region may be a composition different from a composition of the first dielectric material, and in some embodiments the composition within the inner dielectric region may be gaseous.
Public/Granted literature
- US20120326283A1 Interconnect Regions Public/Granted day:2012-12-27
Information query
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