Invention Grant
- Patent Title: Ultrasonic probe and method of manufacturing the same
- Patent Title (中): 超声波探头及其制造方法
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Application No.: US13111246Application Date: 2011-05-19
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Publication No.: US08410666B2Publication Date: 2013-04-02
- Inventor: Hiroyuki Shikata , Satoru Tezuka , Yasuhiro Ona , Takashi Kubota , Yasuhisa Makita
- Applicant: Hiroyuki Shikata , Satoru Tezuka , Yasuhiro Ona , Takashi Kubota , Yasuhisa Makita
- Applicant Address: JP Tokyo JP Tochigi-Ken
- Assignee: Kabushiki Kaisha Toshiba,Toshiba Medical Systems Corporation
- Current Assignee: Kabushiki Kaisha Toshiba,Toshiba Medical Systems Corporation
- Current Assignee Address: JP Tokyo JP Tochigi-Ken
- Agency: Yoshida & Associates, LLC
- Priority: JP2010-120885 20100526
- Main IPC: H01L41/08
- IPC: H01L41/08 ; A61B8/14 ; G01M7/00

Abstract:
According to one embodiment, an ultrasonic probe includes a plurality of piezoelectric elements, a first electrode, a plurality of second electrodes, a plurality of stacked flexible printed circuit boards, and a plurality of connection portions. The plurality of piezoelectric elements are arrayed. The first electrode is provided on the emitting surface side of the plurality of piezoelectric elements. The plurality of second electrodes are respectively provided on the rear surface sides of the plurality of piezoelectric elements. The plurality of stacked flexible printed circuit boards respectively include a plurality of terminals. The plurality of connection portions electrically connect the second electrodes to the terminals. At least one of the flexible printed circuit boards extends longer than the flexible printed circuit board serving as an upper layer.
Public/Granted literature
- US20110295124A1 ULTRASONIC PROBE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2011-12-01
Information query
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