A probe apparatus includes a wire substrate with terminals; a wafer tray forming a hermetically sealed space with the wire substrate and for mounting a semiconductor wafer; a probe wafer provided between the wire substrate and the wafer tray, having an apparatus connection terminal electrically connected to a terminal of the wire substrate and wafer connection terminals electrically connected to the semiconductor chips respectively and collectively; an apparatus anisotropic conductive sheet provided between the wire substrate and the probe wafer; a wafer anisotropic conductive sheet provided between the probe wafer and the semiconductor wafer; and a decompressing section that decompresses the hermetically sealed space between the wire substrate and the wafer tray, to cause the wafer tray to move to a predetermined position from the wire substrate, to electrically connect the wire substrate and the probe wafer, and to electrically connect the probe wafer and the semiconductor wafer.