Invention Grant
- Patent Title: Touchpad with a double-layer printed circuit board structure
- Patent Title (中): 触摸板采用双层印刷电路板结构
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Application No.: US12630782Application Date: 2009-12-03
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Publication No.: US08411065B2Publication Date: 2013-04-02
- Inventor: Jianbo Yang , Bangjun He , Yun Yang , Wei Feng
- Applicant: Jianbo Yang , Bangjun He , Yun Yang , Wei Feng
- Applicant Address: CN Shenzhen
- Assignee: BYD Company Ltd.
- Current Assignee: BYD Company Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Morgan Lewis & Bockius LLP
- Priority: CN200920134417U 20090730
- Main IPC: G06F3/042
- IPC: G06F3/042

Abstract:
The present invention provides a touchpad with a double-layer printed circuit board structure. The touchpad comprises an upper layer, a bottom layer, a first conductor; and a second conductor; wherein the upper layer is configured to act as a touch-sensitive zone, and comprises a plurality of first conductive units, a first conductive wire and a plurality of second conductive units; the bottom layer comprises a wire connecting zone and a component zone, wherein the wire connecting zone further includes a second conductive wire and a connecting line configured to be electrically coupled to the component zone; and the first conductor and the second conductor are configured to connect the upper layer to the bottom layer; wherein the first and the second conductive units are each serially-connected to form a first touch-sensitive line and a second touch-sensitive line, respectively.
Public/Granted literature
- US20110025615A1 Touchpad with a Double-Layer Printed Circuit Board Structure Public/Granted day:2011-02-03
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