Invention Grant
US08411415B2 Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
有权
非热熔性酚醛树脂粉末，其制造方法，热固性树脂组合物，半导体用密封材料和半导体用粘合剂
- Patent Title: Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
- Patent Title (中): 非热熔性酚醛树脂粉末，其制造方法，热固性树脂组合物，半导体用密封材料和半导体用粘合剂
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Application No.: US13420566Application Date: 2012-03-14
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Publication No.: US08411415B2Publication Date: 2013-04-02
- Inventor: Naoto Yoshinaga , Yoshiharu Wakayama , Satoshi Ibaraki , Jun Shimormura , Yoshimi Murage , Niro Shiomi , Yoshinobu Kodani , Takaomi Ikeda
- Applicant: Naoto Yoshinaga , Yoshiharu Wakayama , Satoshi Ibaraki , Jun Shimormura , Yoshimi Murage , Niro Shiomi , Yoshinobu Kodani , Takaomi Ikeda
- Applicant Address: JP Hokkaido
- Assignee: Air Water Inc.
- Current Assignee: Air Water Inc.
- Current Assignee Address: JP Hokkaido
- Agency: Foley & Lardner LLP
- Priority: JP2006-286278 20061020; JP2007-174033 20070702; JP2007-214781 20070821; JP2007-251605 20070927
- Main IPC: H01G9/00
- IPC: H01G9/00
Abstract:
Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 μm and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.
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