Invention Grant
- Patent Title: Resin overcap provided with IC tag
- Patent Title (中): 树脂顶盖配有IC标签
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Application No.: US12993012Application Date: 2009-06-22
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Publication No.: US08411422B2Publication Date: 2013-04-02
- Inventor: Takayuki Kikuchi , Takahiro Kurosawa , Ken Sotobayashi , Masayuki Mori , Kazuo Tanabe
- Applicant: Takayuki Kikuchi , Takahiro Kurosawa , Ken Sotobayashi , Masayuki Mori , Kazuo Tanabe
- Applicant Address: JP Tokyo
- Assignee: Toyo Seikan Kaisha, Ltd.
- Current Assignee: Toyo Seikan Kaisha, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2008-161978 20080620
- International Application: PCT/JP2009/061292 WO 20090622
- International Announcement: WO2009/154292 WO 20091223
- Main IPC: G06F1/16
- IPC: G06F1/16

Abstract:
[Problem] To provide a resin overcap provided with an IC tag that can be used as an overcap being fitted onto a metal cap and having an IC tag that is so provided that the transmission and reception of signals will not be disturbed by the metal cap.[Means for Solution] A resin overcap used being fitted onto a metal cap, comprising a top panel and a cylindrical side wall hanging down from the circumferential edge of the top panel and in which the metal cap is fitted, wherein a step or a protrusion is formed on an upper portion on the inner surface of the cylindrical side wall to prevent the upward motion of the metal cap fitted in the cylindrical side wall, and an IC tag provided with an IC chip is mounted on the top panel in a manner of maintaining a predetermined distance D to a top plate of the metal cap fitted into the cylindrical side wall.
Public/Granted literature
- US20110063786A1 RESIN OVERCAP PROVIDED WITH IC TAG Public/Granted day:2011-03-17
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