Invention Grant
- Patent Title: Keypad assembly and electronic device using the same
- Patent Title (中): 键盘组装和电子设备使用相同
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Application No.: US13004902Application Date: 2011-01-12
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Publication No.: US08411423B2Publication Date: 2013-04-02
- Inventor: Bin Dai
- Applicant: Bin Dai
- Applicant Address: CN Shenzhen CN New Taipei
- Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen CN New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201010251943 20100812
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H01H13/14

Abstract:
A keypad assembly includes a keycap, fixing bracket, and at least one fixing member. The fixing member fixes the keypad to the fixing bracket. The fixing bracket includes a frame, a fixing portion located on a middle portion of the frame, and at least two resilient portions. The resilient portions interconnect the frame and the fixing portions. The keycap fixes on the fixing portion. The resilient portions are capable of elastically deforming and generating elastic restoring force to the keycap.
Public/Granted literature
- US20120039027A1 KEYPAD ASSEMBLY AND ELECTRONIC DEVICE USING THE SAME Public/Granted day:2012-02-16
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