Invention Grant
- Patent Title: Electronic device having heat dissipation airflow path
- Patent Title (中): 具有散热气流路径的电子设备
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Application No.: US13095943Application Date: 2011-04-28
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Publication No.: US08411431B2Publication Date: 2013-04-02
- Inventor: Ji-Feng Qiu , Hong Li , Xiao-Hui Zhou , Hai-Tao Wang
- Applicant: Ji-Feng Qiu , Hong Li , Xiao-Hui Zhou , Hai-Tao Wang
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201010616833 20101231
- Main IPC: G11B33/14
- IPC: G11B33/14 ; H05K7/20

Abstract:
An exemplary electronic device includes a cover, a motherboard and a driving module both disposed at an inner side of the cover, an electronic component fixed on the motherboard, and a fan duct mounted on the motherboard and covering the electronic component. The driving module has a rotating shaft for supportively driving an optical disk rotating. The fan duct guides hot air therein toward the driving module.
Public/Granted literature
- US20120170206A1 ELECTRONIC DEVICE HAVING HEAT DISSIPATION AIRFLOW PATH Public/Granted day:2012-07-05
Information query
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