Embodiments of a tiered damping solution to protect a computer system from shock are disclosed. More specifically, in one embodiment at an external level the computer system may be protected from a shock and vibration by the use of dampeners which may be located on the chassis of the computer system to cover possible contact points. The devices are isolated from remaining shock or vibration by utilizing isolating materials at points where the device mounts to, or otherwise contacts, the chassis. Within the device itself another tier of protection may serve to protect components within a device by isolating the components from the points at which the component mounts to, or otherwise contacts, the device.