A first x-ray image of the circuit board that is equipped with components only on a first side with a first x-ray device (2) that produces transmission images and a second x-ray image of a circuit board that is equipped with components on both sides with a second x-ray device (4) that produces transmission images are recorded in an x-ray testing method for checking circuit boards that are equipped with components on two sides, in particular for checking soldered joints. A test x-ray image is then evaluated in a computer unit in which the second side that is equipped with components is displayed in enhanced form by forming a function from the pixel values of the first x-ray image and the corresponding pixel values of the second x-ray image.