Invention Grant
US08412052B2 Surface mount (SMT) connector for VCSEL and photodiode arrays
有权
用于VCSEL和光电二极管阵列的表面贴装（SMT）连接器
- Patent Title: Surface mount (SMT) connector for VCSEL and photodiode arrays
- Patent Title (中): 用于VCSEL和光电二极管阵列的表面贴装（SMT）连接器
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Application No.: US10971234Application Date: 2004-10-22
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Publication No.: US08412052B2Publication Date: 2013-04-02
- Inventor: Edris M. Mohammed
- Applicant: Edris M. Mohammed
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H04B10/00
- IPC: H04B10/00
Abstract:
Self alignment of Optoelectronic (OE) chips, such as photodiode (PD) modules and vertical cavity surface emitting laser (VCSEL) modules, to external waveguides or fiber arrays may be realized by packaging the OE chips directly in the fiber optic connector.
Public/Granted literature
- US20060088254A1 Surface mount (SMT) connector for VCSEL and photodiode arrays Public/Granted day:2006-04-27
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