Invention Grant
- Patent Title: Power mesh managing method
- Patent Title (中): 电力网管理方法
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Application No.: US13568228Application Date: 2012-08-07
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Publication No.: US08413100B2Publication Date: 2013-04-02
- Inventor: Chia-Lin Chuang
- Applicant: Chia-Lin Chuang
- Applicant Address: TW Hsinchu
- Assignee: RealTek Semiconductor Corp.
- Current Assignee: RealTek Semiconductor Corp.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW97103381A 20080130
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
The invention discloses a power mesh managing method utilized in an integrated circuit. The integrated circuit includes a standard cell and a standard-cell power supplying mesh corresponding to a first direction. The power mesh managing method includes: defining a power supplying network including a first plurality of power meshes growing along the first direction and a second plurality of power meshes growing along a second direction, and defining an assistant connecting network on a third metal layer, wherein the assistant connecting network includes a plurality of assistant connecting lines growing along the second direction, the first plurality of power meshes are formed on a first metal layer, the second plurality of power meshes on a second metal layer, the third metal layer is below the first metal layer, and the second metal layer is above the first metal layer.
Public/Granted literature
- US20120304144A1 Power Mesh Managing Method Public/Granted day:2012-11-29
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