Invention Grant
US08413102B2 Vectorless IVD analysis prior to tapeout to prevent scan test failure due to voltage drop
失效
在进行流片之前的无矢量IVD分析,以防止由于电压降引起的扫描测试故障
- Patent Title: Vectorless IVD analysis prior to tapeout to prevent scan test failure due to voltage drop
- Patent Title (中): 在进行流片之前的无矢量IVD分析,以防止由于电压降引起的扫描测试故障
-
Application No.: US13197146Application Date: 2011-08-03
-
Publication No.: US08413102B2Publication Date: 2013-04-02
- Inventor: Wen-Chieh Jeffrey Yang
- Applicant: Wen-Chieh Jeffrey Yang
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Meyertons, Hood, Kivlin, Kowert & Goetzel, P.C.
- Agent Lawrence J. Merkel
- Main IPC: G06F9/455
- IPC: G06F9/455 ; G06F17/50

Abstract:
In one embodiment, a vectorless IVD methodology may be used to estimate IVD issues for an integrated circuit earlier in the design cycle of the integrated circuit, e.g. when corrective actions may still be taken to correct IVD failures. In the methodology, scan chains for various clusters in the integrated circuit may be identified, even though the scan chains may still be subject to change as the design evolves. A power integrity tool may analyze the scan chains based on a probability of transitions in the devices within the scan chain (e.g. flops) for a theoretical worst-case test vector. If the result of analysis identifies IVD failures in the clusters, corrective action may be taken such as modifying the design. Alternatively, the corrective action may include identifying one or more flops that experience failure as devices to be excluded from the test vector generation process for scan testing.
Public/Granted literature
- US20130036394A1 Vectorless IVD Analysis Prior to Tapeout to Prevent Scan Test Failure Due to Voltage Drop Public/Granted day:2013-02-07
Information query