Invention Grant
- Patent Title: Hinge mechanism
- Patent Title (中): 铰链机构
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Application No.: US13139435Application Date: 2009-10-20
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Publication No.: US08413303B2Publication Date: 2013-04-09
- Inventor: Tetsuro Nagami
- Applicant: Tetsuro Nagami
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2009-028480 20090210
- International Application: PCT/JP2009/005489 WO 20091020
- International Announcement: WO2010/092640 WO 20100819
- Main IPC: E05D11/10
- IPC: E05D11/10

Abstract:
A hinge mechanism includes: a bracket 2 having a rotation shaft portion insertion hole 2a for inserting through a marginal rotating shaft portion 3b thereof, and one engaging concavo-convex section 2b; a plate 5 having a mounting shaft portion insertion hole 5a; and a leaf spring 4 having a mounting shaft portion insertion hole 4a and the other engaging concavo-convex section 4c, and located between the bracket 2 and plate 5 and mounted to the rotation shaft 3, wherein the hole 5a is formed larger than the hole 4a such that the spring 4 is caulked and fixed to the end face of the shaft portion by entering of the outer wall side part of a mounting shaft portion 3c formed on the end face of the portion 3b that is collapsed by caulking into a gap 5c formed between the portion 3c and insertion hole 5a.
Public/Granted literature
- US20110239405A1 HINGE MECHANISM Public/Granted day:2011-10-06
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