Invention Grant
- Patent Title: Method of gold removal from electronic components
- Patent Title (中): 从电子部件中去除金的方法
-
Application No.: US13016316Application Date: 2011-01-28
-
Publication No.: US08413320B2Publication Date: 2013-04-09
- Inventor: Paul B. Hafeli , Eli Holzman , Aaron J. Stein , Michael Vargas
- Applicant: Paul B. Hafeli , Eli Holzman , Aaron J. Stein , Michael Vargas
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Agency: Pierce Atwood LLP
- Agent Joseph M. Maraia
- Main IPC: H01R43/00
- IPC: H01R43/00
Abstract:
In some embodiments, a method removes gold plating on an electronic component. The method includes forming a gold and solder mixture on the electronic component via a first incrementally controlled heating procedure; incrementally cooling the electronic component via a first cooling procedure; wicking part or all of the gold and solder mixture from the electronic component to a metallic screen via a second incrementally controlled heating procedure; and incrementally cooling the electronic component via a second cooling procedure.
Public/Granted literature
- US20120192406A1 GOLD REMOVAL FROM ELECTRONIC COMPONENTS Public/Granted day:2012-08-02
Information query
