Invention Grant
- Patent Title: Component mounting apparatus, component mounting head, and component mounting method
- Patent Title (中): 组件安装装置,部件安装头和部件安装方法
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Application No.: US12741719Application Date: 2008-10-15
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Publication No.: US08413322B2Publication Date: 2013-04-09
- Inventor: Motohiro Higuchi , Ryoji Inutsuka
- Applicant: Motohiro Higuchi , Ryoji Inutsuka
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2007-287967 20071106
- International Application: PCT/JP2008/002909 WO 20081015
- International Announcement: WO2009/060560 WO 20090514
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H05K3/20 ; B23P19/00

Abstract:
An object of the present invention is to provide a component a mounting apparatus capable of accurately determining minute mounting applied pressure. The component mounting head of the component mounting apparatus includes: a movable part having a suction bit section and a movable shaft, a weight compensation mechanism for engaging with the movable shaft to compensate for the gravitational force of the total weight of the movable part and a component suctioned to the suction bit section, on the basis of the total weight; a force determination unit for determining a force applied to the movable part in the vertical direction; and a drive unit for moving the force determination unit in the vertical direction. The control unit of the component mounting apparatus controls the drive unit in such a manner that the determination value of the force determination unit becomes a target value.
Public/Granted literature
- US20100269330A1 COMPONENT MOUNTING APPARATUS, COMPONENT MOUNTING HEAD, AND COMPONENT MOUNTING METHOD Public/Granted day:2010-10-28
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