Invention Grant
- Patent Title: Method of forming connector with isolated conductive paths
- Patent Title (中): 用隔离导电路径形成连接器的方法
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Application No.: US13165314Application Date: 2011-06-21
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Publication No.: US08413325B2Publication Date: 2013-04-09
- Inventor: Michael Dewayne Finke , Jesse Kevin Hensarling , Randal Thomas Beste , Charles Pence Burke , James Neal Spence
- Applicant: Michael Dewayne Finke , Jesse Kevin Hensarling , Randal Thomas Beste , Charles Pence Burke , James Neal Spence
- Applicant Address: US TX Houston
- Assignee: Halliburton Energy Services, Inc.
- Current Assignee: Halliburton Energy Services, Inc.
- Current Assignee Address: US TX Houston
- Agency: Schwegman Lundberg & Woessner, P.A.
- Agent Alan Bryson
- Main IPC: H01R43/00
- IPC: H01R43/00

Abstract:
A method of forming a connector with isolated conductive paths can include using a flexible member. An example of a method of forming a connector with isolated conductive paths can include forming a bulkhead assembly including two-or-more isolated bulkhead conductive paths. A non-bulkhead assembly can be formed including two-or-more isolated non-bulkhead conductive paths. A flexible coupling can be formed between each of the two-or-more isolated bulkhead conductive paths and each of the two-or-more isolated non-bulkhead conductive paths to form a flexible connector. Another example method can include assembling, at least partially, a connector having a groove, securing a flexible member in the groove, and flowing solder into the flexible member in the groove. Additional methods and associated apparatus and systems are disclosed.
Public/Granted literature
- US20110252643A1 CONNECTOR INCLUDING ISOLATED CONDUCTIVE PATHS Public/Granted day:2011-10-20
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