Invention Grant
- Patent Title: Method of manufacturing flow channel substrate for liquid ejection head
- Patent Title (中): 制造液体喷射头用流道基板的方法
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Application No.: US12683132Application Date: 2010-01-06
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Publication No.: US08413328B2Publication Date: 2013-04-09
- Inventor: Tsutomu Yokouchi
- Applicant: Tsutomu Yokouchi
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2007-244069 20070920
- Main IPC: B21D53/76
- IPC: B21D53/76 ; B23P17/00 ; B41J2/015

Abstract:
A method of manufacturing a flow channel substrate, includes the steps of: forming two uneven shapes on a substrate in such a manner that the two uneven shapes follow a liquid flow channel at perimeters of a location where the liquid flow channel is to be formed and the two uneven shapes are configured to prevent a dissolvable resin forming a sacrificial layer from spreading during a heat treatment; forming, between the two uneven shapes on the substrate, the sacrificial layer which is made of the dissolvable resin and has a shape of the liquid flow channel; applying, by the heat treatment, a rounded shape to a corner section of the sacrificial layer on a side which is not in contact with the substrate; forming a coating resin layer on the substrate and the sacrificial layer; patterning the coating resin layer; and dissolving the dissolvable resin forming the sacrificial layer.
Public/Granted literature
- US20100101087A1 METHOD OF MANUFACTURING FLOW CHANNEL SUBSTRATE FOR LIQUID EJECTION HEAD Public/Granted day:2010-04-29
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