Invention Grant
- Patent Title: Spring member for use in a microelectromechanical systems sensor
- Patent Title (中): 用于微机电系统传感器的弹簧构件
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Application No.: US12102601Application Date: 2008-04-14
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Publication No.: US08413509B2Publication Date: 2013-04-09
- Inventor: Aaron A. Geisberger
- Applicant: Aaron A. Geisberger
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agency: Schmeiser, Olsen & Watts LLP
- Agent Lowell W. Gresham; Charlene R. Jacobsen
- Main IPC: G01P15/125
- IPC: G01P15/125 ; G01P15/08

Abstract:
A device (96) includes a microelectromechanical (MEMS) sensor (40). The sensor (40) includes a movable element (42) adapted for motion in a direction (44) and an anchor (46) coupled to a substrate (48). The MEMS sensor (40) further includes spring members (50) interconnected between the movable element (42) and the anchor (46). Each of the spring members (50) includes beams (56, 58, 60) arranged in substantially parallel alignment, with the beam (60) positioned between the other beams (56, 58). Each of the beams (56, 58) is coupled to the anchor (46) and the beam (60) is coupled to the movable element (42). Each of the spring members (50) further includes a support structure (64) joined with the beams (56, 58) to provide vertical stiffness to the beams (56, 58) of the spring member (50).
Public/Granted literature
- US20090256297A1 SPRING MEMBER FOR USE IN A MICROELECTROMECHANICAL SYSTEMS SENSOR Public/Granted day:2009-10-15
Information query
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