Invention Grant
- Patent Title: Stencil kit
- Patent Title (中): 模具套件
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Application No.: US12873095Application Date: 2010-08-31
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Publication No.: US08413579B2Publication Date: 2013-04-09
- Inventor: Gabriella Ferretti
- Applicant: Gabriella Ferretti
- Applicant Address: IT Livorno
- Assignee: Liquiplast S.r.l.
- Current Assignee: Liquiplast S.r.l.
- Current Assignee Address: IT Livorno
- Agency: Sughrue Mion, PLLC
- Priority: ITTO2009U0120 20090901
- Main IPC: B41N1/24
- IPC: B41N1/24

Abstract:
The stencil kit comprises: a first stencil (1a) including a first support (2a) on which a first outer template (4a) is provided, the first outer template (4a) being formed by a plurality of cut out sections (6a) defining a cut out broken line which extends throughout the outer contour of the final decoration; and a second stencil (1b) including a second support (2b) on which a second outer template (4b) is provided, the second outer template (4b) being formed by a plurality of cut out sections (6b) defining a cut out broken line which extends throughout the outer contour of the final decoration. The broken line of the second stencil (1b) is complementary to that of the first stencil (1a).
Public/Granted literature
- US20110056394A1 STENCIL KIT Public/Granted day:2011-03-10
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