Invention Grant
- Patent Title: Hot water supply apparatus
- Patent Title (中): 热水供应装置
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Application No.: US12337037Application Date: 2008-12-17
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Publication No.: US08413615B2Publication Date: 2013-04-09
- Inventor: Chikara Tsuge
- Applicant: Chikara Tsuge
- Applicant Address: JP Aichi-ken
- Assignee: Rinnai Corporation
- Current Assignee: Rinnai Corporation
- Current Assignee Address: JP Aichi-ken
- Agency: Turocy & Watson, LLP
- Priority: JP2007-327327 20071219
- Main IPC: F24H9/20
- IPC: F24H9/20

Abstract:
A hot water supply apparatus including: a hot-water supply pipe for guiding hot water generated by a hot-water generator to a hot-water supplying terminal; two hot-water supply temperature sensors for detecting water temperature in the hot-water supply pipe; a temperature control unit for adjusting a temperature of the hot water supplied to the hot-water supplying terminal; a sensor abnormality determining unit for determining sensor abnormality when a difference between temperatures detected by the two hot-water supply temperature sensors is larger than a predetermined permissible error; a sensor selector for selectively setting one hot-water supply temperature sensor detecting a higher temperature as a hot-water supply temperature sensor for temperature control; and a hot-water supply temperature controller for controlling the temperature control unit so that a temperature detected by the hot-water supply temperature sensor for temperature control selected from the two hot-water supply temperature sensors is matched with a set temperature.
Public/Granted literature
- US20090159017A1 HOT WATER SUPPLY APPARATUS Public/Granted day:2009-06-25
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