Invention Grant
- Patent Title: Housing structure for in-vehicle electronic device
- Patent Title (中): 车载电子设备的外壳结构
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Application No.: US12724980Application Date: 2010-03-16
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Publication No.: US08414013B2Publication Date: 2013-04-09
- Inventor: Takeshi Koyama
- Applicant: Takeshi Koyama
- Applicant Address: JP Kobe
- Assignee: Fujitsu Ten Limited
- Current Assignee: Fujitsu Ten Limited
- Current Assignee Address: JP Kobe
- Agency: Oliff & Berridge, PLC
- Priority: JP2009-091597 20090403
- Main IPC: B60R21/01
- IPC: B60R21/01

Abstract:
A housing structure for an in-vehicle electronic device is provided. A case body includes a top panel and a side wall continuously and integrally formed at a side edge of the top panel. The case body is configured to accommodate a control board therein. A plurality of brackets outwardly projects and extends from the side wall of the case body. The brackets are fixed to an attachment portion of a vehicle body. A plurality of reinforcement ribs are integrally formed between the brackets and the side wall of the case body at a position lower than the control board in a state where the case body is mounted on the vehicle body.
Public/Granted literature
- US20100253188A1 HOUSING STRUCTURE FOR IN-VEHICLE ELECTRONIC DEVICE Public/Granted day:2010-10-07
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