Invention Grant
- Patent Title: Liquid supplying apparatus and liquid ejecting apparatus
- Patent Title (中): 液体供给装置和液体喷射装置
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Application No.: US13194530Application Date: 2011-07-29
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Publication No.: US08414115B2Publication Date: 2013-04-09
- Inventor: Hiroshi Shibata
- Applicant: Hiroshi Shibata
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2010-172786 20100730
- Main IPC: B41J2/175
- IPC: B41J2/175

Abstract:
A liquid supplying apparatus includes: a pressure applying device applying pressure to the liquid inside a supply flow channel connected to a liquid supply object; a pressure buffering unit including a deformable or movable partition separating a liquid chamber connected to the supply flow channel and a gas chamber; a gas flow channel switching device connecting and disconnecting the gas chamber and a gas storage unit; an atmosphere connection channel switching device connecting and disconnecting the gas storage unit to and from the atmosphere; a switching controlling device controlling operations of the gas flow channel switching device and the atmosphere connection channel switching device during initial position adjustment of the partition and during pressurization of the liquid supply object; and a pressure controlling device controlling the pressure applying device in response to the operations of the gas flow channel switching device and the atmosphere connection channel switching device.
Public/Granted literature
- US20120026256A1 LIQUID SUPPLYING APPARATUS AND LIQUID EJECTING APPARATUS Public/Granted day:2012-02-02
Information query
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