Invention Grant
- Patent Title: LED heat-dissipation structure for matrix LED lamp
- Patent Title (中): LED散热结构LED矩阵灯
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Application No.: US13083662Application Date: 2011-04-11
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Publication No.: US08414152B2Publication Date: 2013-04-09
- Inventor: Hsu Li Yen
- Applicant: Hsu Li Yen
- Agency: Rosenberg, Klein & Lee
- Main IPC: F21V21/00
- IPC: F21V21/00

Abstract:
An improved heat-dissipation structure for a matrix LED lamp is disclosed. The heat-dissipation structure is a plate-shaped metal hood configured to hold an LED matrix module for heat dissipation so as to maintain the entire matrix LED lamp cool. The heat-dissipation structure is a plate-shaped metal shell having a plurality of threaded holes allowing the LED matrix module to be fixed thereto. In virtue of the tight contact between the bottom of the LED matrix module and the plate-shaped metal hood, heat generated by the LED matrix module can be quickly absorbed and dissipated by the plate-shaped metal hood, so as to prevent the LED matrix module from premature aging, thereby enlightening the service life of the LED matrix module.
Public/Granted literature
- US20120255717A1 LED HEAT-DISSIPATION STRUCTURE FOR MATRIX LED LAMP Public/Granted day:2012-10-11
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