Invention Grant
- Patent Title: Processing apparatus and processing method
- Patent Title (中): 处理装置及处理方法
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Application No.: US12579519Application Date: 2009-10-15
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Publication No.: US08414242B2Publication Date: 2013-04-09
- Inventor: Katsuyuki Hishiya
- Applicant: Katsuyuki Hishiya
- Applicant Address: JP Minato-Ku
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Minato-Ku
- Agency: Burr & Brown
- Priority: JP2008-267584 20081016
- Main IPC: H01L21/677
- IPC: H01L21/677

Abstract:
A processing apparatus including: a carry-in area into which a container containing substrates to be processed is carried, the container having a flange part on an upper part thereof and an opening in a front surface thereof, with a lid being detachably fixed to the opening; a transfer area whose atmosphere is maintained differently from an atmosphere of the carry-in area; a partition wall separating the carry-in area and transfer area; a through-hole formed in the partition wall; a door configured to open and close the through-hole; and a table on which the container can be placed in the carry-in area. After the container has been placed and then held on the table, the container is brought into contact with the through-hole, the door and the lid are opened, and the substrates to be processed in the container are conveyed to the transfer area so as to process the substrates.
Public/Granted literature
- US20100098517A1 PROCESSING APPARATUS AND PROCESSING METHOD Public/Granted day:2010-04-22
Information query
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