Invention Grant
- Patent Title: Socket terminal for grid array connector
- Patent Title (中): 栅格阵列连接器的插座端子
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Application No.: US13042820Application Date: 2011-03-08
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Publication No.: US08414311B2Publication Date: 2013-04-09
- Inventor: Ted Ju
- Applicant: Ted Ju
- Applicant Address: TW Keelung
- Assignee: Lotes Co., Ltd
- Current Assignee: Lotes Co., Ltd
- Current Assignee Address: TW Keelung
- Agency: Morris Manning & Martin LLP
- Agent Tim Tingkang Xia, Esq
- Priority: CN201020671332U 20101220
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
An electrical connector that includes: an insulating body, having a plurality of receiving slots running through the insulating body, a plurality of terminals, respectively received in the receiving slots, in which the terminal has a base fixed in the receiving slot, two first abutting segments extending downwards from the base, two second abutting segments extending forwards the two first abutting segments, the two second abutting segments are exposed from the receiving slot and abut against the bottom surface of the insulating body, the width between the two second abutting segments is smaller than the diameter of a solder ball, a plurality of stop blocks, respectively disposed in the receiving slots, and a plurality of solder balls, respectively received in the receiving slots.
Public/Granted literature
- US20120156939A1 ELECTRICAL CONNECTOR Public/Granted day:2012-06-21
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