Invention Grant
- Patent Title: Grounding a docking station with a host device using grounding layers of multilayer printed circuit boards
- Patent Title (中): 使用多层印刷电路板的接地层将主机设备对接站接地
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Application No.: US13213067Application Date: 2011-08-18
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Publication No.: US08414312B2Publication Date: 2013-04-09
- Inventor: Chin-Chung Hung , Yu-Jen Li , Tsung-Jen Su
- Applicant: Chin-Chung Hung , Yu-Jen Li , Tsung-Jen Su
- Applicant Address: TW Xizhi Dist., New Taipei
- Assignee: Wistron Corporation
- Current Assignee: Wistron Corporation
- Current Assignee Address: TW Xizhi Dist., New Taipei
- Agent Winston Hsu; Scott Margo
- Priority: TW99217945U 20100916
- Main IPC: H01R4/66
- IPC: H01R4/66
Abstract:
A connector structure includes a first connector installed on a host device. The first connector includes a first base, a first terminal set installed on the first base, and a first grounding component installed on the first base. The connector structure further includes a second connector installed on a docking station for connecting with the first connector. The second connector includes a second base, a second terminal set installed on the second base for contacting with the first terminal set so as to transmit signals between the host device and the docking station with the first terminal set when the host device is docked in the docking station, and a second grounding component installed on the second base for contacting with the first grounding component so as to ground with the first grounding component when the host device is docked in the docking station.
Public/Granted literature
- US20120071013A1 CONNECTOR STRUCTURE AND COMPUTER SYSTEM WITH GROUNDING FUNCTION Public/Granted day:2012-03-22
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