Invention Grant
- Patent Title: Polishing pad, the use thereof and the method for manufacturing the same
- Patent Title (中): 抛光垫及其制造方法
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Application No.: US12883446Application Date: 2010-09-16
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Publication No.: US08414669B2Publication Date: 2013-04-09
- Inventor: Chung-Chih Feng , I-Peng Yao , Lyang-Gung Wang , Yung-Chang Hung
- Applicant: Chung-Chih Feng , I-Peng Yao , Lyang-Gung Wang , Yung-Chang Hung
- Applicant Address: TW Kaohsiung
- Assignee: San Fang Chemical Industry Co., Ltd.
- Current Assignee: San Fang Chemical Industry Co., Ltd.
- Current Assignee Address: TW Kaohsiung
- Agency: WPAT, P.C.
- Agent Anthony King
- Main IPC: B24D11/00
- IPC: B24D11/00

Abstract:
The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a first membrane with low permeability; a two-component paste formed on the upper surface of the first membrane with low permeability for adhering the base material to the first membrane with low permeability; and a polyurethane paste formed on the lower surface of the first membrane with low permeability. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad as described above are also provided. The polishing pad as mentioned above prevents the polishing pad from detaching from the polishing platen or head. The polishing pad is easy to be replaced without leaving residues on the polishing platen or head.
Public/Granted literature
- US20110000141A1 Polishing Pad, the Use Thereof and the Method for Manufacturing the Same Public/Granted day:2011-01-06
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