Invention Grant
US08414705B2 Seal mechanism, seal trench, seal member, and substrate processing apparatus
有权
密封机构,密封沟槽,密封件和基板处理装置
- Patent Title: Seal mechanism, seal trench, seal member, and substrate processing apparatus
- Patent Title (中): 密封机构,密封沟槽,密封件和基板处理装置
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Application No.: US12357689Application Date: 2009-01-22
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Publication No.: US08414705B2Publication Date: 2013-04-09
- Inventor: Yusuke Nakagawa
- Applicant: Yusuke Nakagawa
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-011601 20080122
- Main IPC: C23C16/00
- IPC: C23C16/00 ; F16J15/00 ; F16J15/02 ; F16J15/06 ; F16J15/10

Abstract:
A seal mechanism that can prevent the occurrence of corrosion and abnormal discharge. The seal mechanism is disposed between first and second structural members having opposing surfaces. A first seal trench and a second seal trench are formed respectively in a first opposing surface of the first structural member and in a second opposing surface of the second structural member. A first seal member and a second seal member are housed respectively in the first and second seal trenches. The first seal member and the second seal member are brought into pressure contact with each other. These seal trenches have a first seal surface and a second seal surface from which aluminum is exposed, and further have first shut-off surface disposed between the first opposing surface and the first seal surface and a second shut-off surface disposed between the second opposing surface and the second seal surface. The first seal member has a first covering portion that covers the first shut-off surface, and the second seal member has a second covering portion that covers the second shut-off surface.
Public/Granted literature
- US20090183832A1 SEAL MECHANISM, SEAL TRENCH, SEAL MEMBER, AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2009-07-23
Information query
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