Invention Grant
US08414735B2 Ring-shaped component for use in a plasma processing, plasma processing apparatus and outer ring-shaped member
有权
用于等离子体处理，等离子体处理装置和外环形构件的环形部件
- Patent Title: Ring-shaped component for use in a plasma processing, plasma processing apparatus and outer ring-shaped member
- Patent Title (中): 用于等离子体处理，等离子体处理装置和外环形构件的环形部件
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Application No.: US13233968Application Date: 2011-09-15
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Publication No.: US08414735B2Publication Date: 2013-04-09
- Inventor: Takahiro Murakami , Nobuhiro Sato
- Applicant: Takahiro Murakami , Nobuhiro Sato
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: JP2005-255179 20050902
- Main IPC: C23F1/00
- IPC: C23F1/00 ; H01L21/306 ; C23C16/00
Abstract:
A ring-shaped component for use in a plasma processing includes an inner ring-shaped member provided to surround an outer periphery of a substrate to be subjected to the plasma processing and an outer ring-shaped member provided to surround an outer periphery of the inner ring-shaped member. The outer ring-shaped member has a first surface facing a processing space side and a second surface facing an opposite side of the plasma generation side. The second surface has thereon one or more ring-shaped grooves.
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