Invention Grant
- Patent Title: Method and composition for chemical mechanical planarization of a metal
- Patent Title (中): 金属化学机械平面化的方法和组成
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Application No.: US12632111Application Date: 2009-12-07
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Publication No.: US08414789B2Publication Date: 2013-04-09
- Inventor: Xiaobo Shi , Bentley J. Palmer , Rebecca A. Sawayda , Fadi Abdallah Coder , Victoria Perez
- Applicant: Xiaobo Shi , Bentley J. Palmer , Rebecca A. Sawayda , Fadi Abdallah Coder , Victoria Perez
- Applicant Address: US PA Allentown
- Assignee: Air Products and Chemicals, Inc.
- Current Assignee: Air Products and Chemicals, Inc.
- Current Assignee Address: US PA Allentown
- Agent Lina Yang
- Main IPC: C03C15/00
- IPC: C03C15/00
Abstract:
A composition and associated method for chemical mechanical planarization of a metal-containing substrate (e.g., a copper substrate) are described herein which afford high and tunable rates of metal removal as well as low within a wafer non-uniformity values and low residue levels remaining after polishing.
Public/Granted literature
- US20100167545A1 Method and Composition for Chemical Mechanical Planarization of A Metal Public/Granted day:2010-07-01
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