Invention Grant
- Patent Title: Micronized copper-containing compositions useful to mitigate residues on wood surfaces
-
Application No.: US13573402Application Date: 2012-09-13
-
Publication No.: US08414931B2Publication Date: 2013-04-09
- Inventor: Jayesh P. Patel
- Applicant: Jayesh P. Patel
- Applicant Address: US GA Atlanta
- Assignee: Arch Wood Protection, Inc.
- Current Assignee: Arch Wood Protection, Inc.
- Current Assignee Address: US GA Atlanta
- Agency: Lucas & Mercanti, LLP
- Main IPC: A01N59/20
- IPC: A01N59/20 ; A01N43/00 ; A01N55/02 ; C09K15/02 ; C09K15/30 ; C09D5/16 ; C08L89/00 ; B05D1/18
Abstract:
Disclosed is a wood preservative composition comprising micronized copper and copper-amine complex, wherein the copper component of the copper amine complex is from about 5% to about 50% by weight, based upon the total weight of copper in the composition. The copper amine complex serves to avoid wood surface “chalking” that is otherwise attributable to the presence of micronized copper in copper-based slurries used to treat wood products. In addition, the copper-amine complex enhances the antimicrobial efficacy of the composition when used in wood treatment applications by facilitating cell wall penetration of the treated wood.
Public/Granted literature
- US20130017271A1 Micronized copper-containing compositions useful to mitigate residues on wood surfaces Public/Granted day:2013-01-17
Information query
