Disclosed is a method and apparatus for continuous coating with a rotational die in which coating materials flow in a radial direction. The linear speed of a substrate in need of coating is identical to the tangential speed of the surface of the rotational die so that the coating material, which flows in a radial direction of the rotational die, flows onto the substrate perpendicularly. Therefore, the ingredients of coating materials overlap one another (or stand vertically as a layer), and the vertical sequence of the coating material is ensured. This method and apparatus can be used to make organic electronic devices, organic light-emitting diodes and organic photovoltaic devices. Particularly, this method and apparatus can be used in bulk-hetero-junction of mixed coating of P-type and N-type semiconductors.