Invention Grant
- Patent Title: Method for disposing a component
- Patent Title (中): 配置组件的方法
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Application No.: US13540237Application Date: 2012-07-02
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Publication No.: US08414976B2Publication Date: 2013-04-09
- Inventor: Hidekazu Arase
- Applicant: Hidekazu Arase
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2011-091667 20110418
- Main IPC: H01L21/52
- IPC: H01L21/52 ; H01L21/50 ; G02F1/1343 ; G02F1/1362

Abstract:
Provided is a method for disposing a component on a substrate (100), the method comprising steps of: a step (a) of preparing the substrate (100), a first liquid, and a component-dispersing liquid; a step (b) of applying the first liquid to the substrate (100) along the +X direction continuously to dispose the first liquid on hydrophilic lines (112) and hydrophilic body regions (111) along the +X direction alternately; a step (c) of bringing the component-dispersing liquid in contact with the first liquid disposed on the hydrophilic region (111); and a step (d) of removing the first liquid and the second liquid from the substrate (100) to dispose the component on the hydrophilic region (111).
Public/Granted literature
- US20120269971A1 METHOD FOR DISPOSING A COMPONENT Public/Granted day:2012-10-25
Information query
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