Invention Grant
- Patent Title: Masking jig, substrate heating device, and coating method
- Patent Title (中): 掩模夹具，基板加热装置和涂布方法
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Application No.: US13133271Application Date: 2010-05-10
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Publication No.: US08414977B2Publication Date: 2013-04-09
- Inventor: Takashi Ikejiri
- Applicant: Takashi Ikejiri
- Applicant Address: JP Toyota-shi
- Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee Address: JP Toyota-shi
- Agency: Kenyon & Kenyon LLP
- International Application: PCT/JP2010/057856 WO 20100510
- International Announcement: WO2011/141979 WO 20111117
- Main IPC: B05D1/32
- IPC: B05D1/32 ; B05C19/00
Abstract:
A masking jig for specifying a coating region on which a coating is formed by spraying copper powder onto a front surface of an insulating substrate from a cold spray device. This masking jig includes a metal member formed with an opening for specifying the coating region and placed in contact with the front surface of the insulating substrate. The metal member internally includes a heating wire is provided to heat the vicinity of the opening. A cooler is connected to a back surface of the insulating substrate.
Public/Granted literature
- US20120148738A1 MASKING JIG, SUBSTRATE HEATING DEVICE, AND COATING METHOD Public/Granted day:2012-06-14
Information query
