Invention Grant
- Patent Title: Method of manufacturing a circuit board
- Patent Title (中): 制造电路板的方法
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Application No.: US12723949Application Date: 2010-03-15
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Publication No.: US08415002B2Publication Date: 2013-04-09
- Inventor: James A. McCall , David Shykind
- Applicant: James A. McCall , David Shykind
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: International IP Law Group, P.L.L.C.
- Main IPC: B32B3/00
- IPC: B32B3/00 ; H05K1/00

Abstract:
A method of manufacturing a circuit board which may include the steps of forming a circuit board with horizontal and vertical fiberglass fibers, rotating the circuit board, and cutting the circuit board so that the horizontal and vertical fiberglass fibers form a non-right angle with a cut line of the circuit board. The circuit board may have a plurality of conductive traces located thereon which pass by areas of higher fiberglass-to-resin material and lower fiberglass-to-resin material to assist in reducing differential to common mode conversion between signals in the plurality of conducive traces.
Public/Granted literature
- US20100170087A1 Method of manufacturing a circuit board Public/Granted day:2010-07-08
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