Invention Grant
- Patent Title: Cutting tool
- Patent Title (中): 切割用具
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Application No.: US12863239Application Date: 2009-01-29
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Publication No.: US08415033B2Publication Date: 2013-04-09
- Inventor: Masahito Matsuzawa
- Applicant: Masahito Matsuzawa
- Applicant Address: JP Kyoto
- Assignee: KYOCERA Corporation
- Current Assignee: KYOCERA Corporation
- Current Assignee Address: JP Kyoto
- Agency: Procopio, Cory, Hagreaves & Savitch LLP
- Priority: JP2008-017105 20080129; JP2008-167413 20080626; JP2008-219246 20080828
- International Application: PCT/JP2009/051483 WO 20090129
- International Announcement: WO2009/096476 WO 20090806
- Main IPC: B32B9/00
- IPC: B32B9/00
Abstract:
A cutting tool is disclosed. The cutting tool comprises a substrate and a coating layer on the substrate. The coating layer consists of nitride or carbonitride containing Ti and Al, and has a thickness of 3 to 9 μm on a flank face. A first intensity ratio I(400)/I(311) of the coating layer on an outer surface is larger than the first intensity ratio of the coating layer on the substrate side.
Public/Granted literature
- US20110058909A1 Cutting Tool Public/Granted day:2011-03-10
Information query
