Invention Grant
- Patent Title: Identification of dies on a semiconductor wafer
- Patent Title (中): 识别半导体晶片上的裸片
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Application No.: US13160901Application Date: 2011-06-15
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Publication No.: US08415175B2Publication Date: 2013-04-09
- Inventor: Shen Wang , Robert P. Fabinski , James E. Doran , Laurel J. Pace , Eric J. Meisenzahl
- Applicant: Shen Wang , Robert P. Fabinski , James E. Doran , Laurel J. Pace , Eric J. Meisenzahl
- Applicant Address: US NY Rochester
- Assignee: Truesense Imaging, Inc.
- Current Assignee: Truesense Imaging, Inc.
- Current Assignee Address: US NY Rochester
- Agency: Howard & Howard Attorneys PLLC
- Main IPC: G01R31/26
- IPC: G01R31/26 ; H01L21/66
Abstract:
A semiconductor wafer includes multiple dies and a die identification region adjacent to or on each die. The die identification region can include a wafer indicator and a pattern of die locations representing die locations on the wafer. A die identification marker is provided in each pattern of die locations in the die identification region specifying a location of a respective die on the wafer.
Public/Granted literature
- US20120322271A1 IDENTIFICATION OF DIES ON A SEMICONDUCTOR WAFER Public/Granted day:2012-12-20
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