Invention Grant
- Patent Title: Integrally fabricated micromachine and logic elements
- Patent Title (中): 整体制造的微机械和逻辑元件
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Application No.: US13218987Application Date: 2011-08-26
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Publication No.: US08415191B2Publication Date: 2013-04-09
- Inventor: Stefan Kolb , Reinhard Mahnkopf , Christian Pacha , Bernhard Winkler , Werner Weber
- Applicant: Stefan Kolb , Reinhard Mahnkopf , Christian Pacha , Bernhard Winkler , Werner Weber
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Patterson Thuente Pedersen, P.A.
- Main IPC: H01L29/84
- IPC: H01L29/84

Abstract:
Embodiments relate to micromachine structures. In one embodiment, a micromachine structure includes a first electrode, a second electrode, and a sensing element. The sensing element is mechanically movable and is disposed intermediate the first and second electrodes and adapted to oscillate between the first and second electrodes. Further, the sensing element includes a FinFET structure having a height and a width, the height being greater than the width.
Public/Granted literature
- US20120061777A1 INTEGRALLY FABRICATED MICROMACHINE AND LOGIC ELEMENTS Public/Granted day:2012-03-15
Information query
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