Invention Grant
- Patent Title: Dicing tape-integrated film for semiconductor back surface
- Patent Title (中): 用于半导体背面的切割胶带一体化膜
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Application No.: US12814743Application Date: 2010-06-14
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Publication No.: US08415201B2Publication Date: 2013-04-09
- Inventor: Miki Hayashi , Naohide Takamoto
- Applicant: Miki Hayashi , Naohide Takamoto
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2009-142231 20090615; JP2010-103964 20100428
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
The present invention provides a dicing tape-integrated film for semiconductor back surface, including: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which the film for flip chip type semiconductor back surface has a storage elastic modulus (at 60° C.) of from 0.9 MPa to 15 MPa.
Public/Granted literature
- US20100314781A1 DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE Public/Granted day:2010-12-16
Information query
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