Invention Grant
- Patent Title: Method of forming a semiconductor package including two devices
- Patent Title (中): 形成包括两个装置的半导体封装的方法
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Application No.: US12240509Application Date: 2008-09-29
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Publication No.: US08415203B2Publication Date: 2013-04-09
- Inventor: Kenneth R. Burch , Marc A. Mangrum , William H. Lytle
- Applicant: Kenneth R. Burch , Marc A. Mangrum , William H. Lytle
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of forming a semiconductor package includes providing a carrier, attaching a first surface of a first device on the carrier, wherein the first surface comprises a first active surface of the first device, and attaching a second surface of a second device on the carrier. In one embodiment, the second surface is opposite a third surface of the second semiconductor die and the third surface comprises a second active surface. A first insulating material can be formed between the first device and the second device.
Public/Granted literature
- US20100078808A1 PACKAGING HAVING TWO DEVICES AND METHOD OF FORMING THEREOF Public/Granted day:2010-04-01
Information query
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