Invention Grant
- Patent Title: Integrated circuit packaging system with heat spreader and method of manufacture thereof
- Patent Title (中): 具有散热器的集成电路封装系统及其制造方法
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Application No.: US12412315Application Date: 2009-03-26
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Publication No.: US08415204B2Publication Date: 2013-04-09
- Inventor: JaEun Yun , Jong Wook Ju , WonJun Ko , Hye Ran Lee
- Applicant: JaEun Yun , Jong Wook Ju , WonJun Ko , Hye Ran Lee
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of manufacture of an integrated circuit packaging system includes: providing a package substrate; mounting an integrated circuit die on the package substrate; and attaching a heat spreader assembly, having a thermal adhesive layer formed therein, to the package substrate and the integrated circuit die.
Public/Granted literature
- US20100244236A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEAT SPREADER AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2010-09-30
Information query
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