Invention Grant
- Patent Title: Integrated circuit packaging system with lead interlocking mechanisms and method of manufacture thereof
- Patent Title (中): 具有引线互锁机构的集成电路封装系统及其制造方法
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Application No.: US12961494Application Date: 2010-12-06
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Publication No.: US08415205B2Publication Date: 2013-04-09
- Inventor: Zigmund Ramirez Camacho , Henry Descalzo Bathan , Emmanuel Espiritu
- Applicant: Zigmund Ramirez Camacho , Henry Descalzo Bathan , Emmanuel Espiritu
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50 ; H01L23/495
Abstract:
A method of manufacture of an integrated circuit packaging system includes: forming a lead having an upper portion and a bottom portion with a first overhang portion from a top surface of the upper portion and the lead also having serrations along upper vertical sides intersecting the top surface; forming an upper contact plate on the top surface; forming a bottom contact plate on a bottom surface of the bottom portion; attaching an integrated circuit die over the upper portion; and encapsulating the upper portion and the integrated circuit die with an encapsulation leaving the bottom portion exposed.
Public/Granted literature
- US20110169151A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEAD INTERLOCKING MECHANISMS AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2011-07-14
Information query
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